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Solid State Technology

Volumn 42, Issue 1-8, 1999, Pages 73-78

Silicon wafer bonding for MEMS manufacturing

(2) Mirza, A R a Ayon A A b

a Electronic Visions Inc (United States)

b MASSACHUSETTS INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346613554 PISSN: 0038111X EISSN: None Source Type: Trade Journal
DOI: None Document Type: Article

Times cited : (21)

References (10)

1
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- Integrated Sensor Wafer-Level Packaging
- Chicago, Transducers '97, 1D4.09P
- S.A. Audet, K.M. Edenfeld, "Integrated Sensor Wafer-Level Packaging," Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators, Chicago, Transducers '97, 1D4.09P, pp. 287-289.
- Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators , pp. 287-289
- Audet, S.A.¹ Edenfeld, K.M.²

2
- 0032136370
- Wafer-to-Wafer Bonding for Microstructure Formation
- August
- M.A. Schmidt, "Wafer-to-Wafer Bonding for Microstructure Formation," Proceedings of the IEEE, Vol. 86, No. 8, pp. 1575-1585, August 1998.
- (1998) Proceedings of the IEEE , vol.86 , Issue.8 , pp. 1575-1585
- Schmidt, M.A.¹

3
- 0004222746
- Artech House Publishers
- L. Ristic, Sensor Technology and Devices, Artech House Publishers, 1994.
- (1994) Sensor Technology and Devices
- Ristic, L.¹

4
- 0000823572
- Silicon Wafer Bonding for Micromechanical Devices
- Hilton Head Island, South Carolina, June
- M.A. Schmidt, "Silicon Wafer Bonding for Micromechanical Devices," Solid State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, pp. 127-131, June 1994.
- (1994) Solid State Sensor and Actuator Workshop , pp. 127-131
- Schmidt, M.A.¹

5
- 0002284323
- Bonding Techniques for Microsensors
- eds., C.D. Fung, P.W. Cheung, W.H. Ko, D.G. Fleming, Elsevier Science Publishers
- W.H. Ko, J.T. Suminto, G.J. Yeh, "Bonding Techniques for Microsensors," in Micromachining and Micropackaging of Transducers, eds., C.D. Fung, P.W. Cheung, W.H. Ko, D.G. Fleming, Elsevier Science Publishers, 1985.
- (1985) Micromachining and Micropackaging of Transducers
- Ko, W.H.¹ Suminto, J.T.² Yeh, G.J.³

6
- 0014563672
- Field-Assisted Glass-Metal Sealing
- G.D. Wallis, D.I. Pomerantz, "Field-Assisted Glass-Metal Sealing," J. Appl. Physics, Vol. 40, pp. 3946-3949, 1969.
- (1969) J. Appl. Physics , vol.40 , pp. 3946-3949
- Wallis, G.D.¹ Pomerantz, D.I.²

7
- 84962883022
- A Performance Evaluation of MEMS-Based Micronozzles
- Seattle, WA, July
- R. Bayt, A.A. Ayón, K. Breuer, "A Performance Evaluation of MEMS-Based Micronozzles," 33rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit, Seattle, WA, July 1997.
- (1997) 33rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit
- Bayt, R.¹ Ayón, A.A.² Breuer, K.³

8
- 0343161340
- Silicon-Silicon Direct Wafer Bonding
- Hawaii, PV20-10
- D.L. Hughes, "Silicon-Silicon Direct Wafer Bonding," Second International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Hawaii, PV20-10, pp. 17-31, 1992.
- (1992) Second International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications , pp. 17-31
- Hughes, D.L.¹

9
- 0028429727
- Low-Temperature Silicon Wafer-to-Wafer Bonding using Gold at Eutectic Temperature
- R.F. Wolffenbutel, K.D. Wise, "Low-Temperature Silicon Wafer-to-Wafer Bonding using Gold at Eutectic Temperature," Sensors and Actuators A, Vol. 43, pp. 223-229, 1994.
- (1994) Sensors and Actuators A , vol.43 , pp. 223-229
- Wolffenbutel, R.F.¹ Wise, K.D.²

10
- 33644949327
- Bonding of Silicon Wafers for Silicon-on-Insulator
- Nov.
- W.P. Maszara et al, "Bonding of Silicon Wafers for Silicon-on-Insulator," J. Appl. Phys., Vol. 64, No. 10, p. 4943, Nov. 1988.
- (1988) J. Appl. Phys. , vol.64 , Issue.10 , pp. 4943
- Maszara, W.P.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.