Fast thermal profiling of power semiconductor devices using fourier techniques

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2003, Pages 1023-1028

  Nelson, Jody J ^a   Venkataramanan, Giri ^a   EL Refaie, Ayman M ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Fourier techniques; Power semiconductor device reliability; Thermal analysis

Indexed keywords

FOURIER TRANSFORMS; SEMICONDUCTOR DEVICES; THERMOANALYSIS; TIME DOMAIN ANALYSIS; TRANSIENTS;

POWER SEMICONDUCTOR DEVICES;

POWER ELECTRONICS;

EID: 0037230661     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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