Relief of the internal stress in ternary boron carbonitride thin films

Applied Surface Science

Volumn 191, Issue 1-4, 2002, Pages 338-343

  He, Deyan ^a   Cheng, Wenjuan ^a   Qin, Juan ^a   Yue, Jinshun ^a   Xie, Erqing ^a   Chen, Guanghua ^b  

^a LANZHOU UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Buckling pattern; Buckling driven delamination theory; Compressive stress; Ternary boron carbonitride thin films

Indexed keywords

BUCKLING; COMPRESSIVE STRESS; DELAMINATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SILICON WAFERS; SPUTTER DEPOSITION; TERNARY SYSTEMS; X RAY PHOTOELECTRON SPECTROSCOPY;

BUCKLING DRIVEN DELAMINATION THEORY;

THIN FILMS;

EID: 0037123481     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)00254-4     Document Type: Article

References (17)