Test results on a thermo-syphon concept to high-power cool desktop computers and servers

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2002, Pages 151-158

  Webb, Ralph L ^a   Yamauchi, Shinobu ^b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b Showa Denko Materials Co   (Japan)

Author keywords

Boiling; Cooling device; Heat exchanger; Thermal resistance; Thermo syphon

Indexed keywords

HEAT EXCHANGERS; HEAT RESISTANCE; PERSONAL COMPUTERS; SERVERS; SINTERING;

THERMO-SYPHON DEVICES;

COOLING SYSTEMS;

EID: 0036212407     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2002.991361     Document Type: Article

References (12)

1. Thermal performance limits of forced convection air cooled plane fin heat sink for computer cooling
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5. Thermo-syphon concept to cool desktop computers and severs
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7. Constriction/spreading resistance model for electronic packaging
8. Advanced heat exchange technology for thermoelectric cooling devices
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10. High efficiency heat exchangers
11. Nucleate boiling from porous metal films: Effect of primary variables
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