Effects of post-deposition annealing on the copper films electrodeposited on the ECR plasma cleaned copper seed layer

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 12, 2002, Pages 7476-7480

  Lee, Hanseung ^a   Chakrabarti, Kuntal ^a   Lee, Chongmu ^a  

^a Inha University   (South Korea)

Author keywords

Copper electroplating; Post deposition annealing; Resistivity; XRD, AFM

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRODEPOSITION; RAPID THERMAL ANNEALING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

COPPER FILMS;

COPPER;

EID: 0036997087     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.7476     Document Type: Article

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