MEMS phased array detection in contact with solids

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2002, Pages 1035-1038

  Greve, D W ^a   Jain, A ^a   Oppenheim, I J ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMPEDANCE; ADHESIVES; DAMPING; DIAPHRAGMS; ETCHING; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; OXIDES; PIEZOELECTRIC MATERIALS; SILICONES; VOLTAGE MEASUREMENT;

INTERNAL DAMPING; PHASED-ARRAY DETECTOR; ULTRASONIC FLAW DETECTION;

ULTRASONIC TRANSDUCERS;

EID: 0036995398     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. "Surface micromachined ultrasound transducers in CMOS technology," P.-C. Eccardt, K. Niederer, T. Scheiter, and C. Hierold, 1996 IEEE Ultrasonics Symposium, pp. 959-962 (1996).
2. "Micromachined ultrasonic capacitance transducers for immersion applications," A.G. Bashford, D.W. Schindel, D.A. Hutchins, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 45, pp. 367-375 (1988).
3. "Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducers arrays," X. Jin, I. Ladabaum, F.L. Degertekin, S. Calmes, and B.T. Khuri-Yakub, IEEE Journal of Microelectromechanical Systems, vol. 8, pp. 100-114 (1999).
4. "Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays," X. Jin, O. Oralkan, F.L. Degertekin, and B.T. Khuri-Yakub, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 48, pp. 750-760 (2001).
5. I.J. Oppenheim, A. Jain, and D.W. Greve, (submitted to IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control).