A fully integrated broad-band amplifier MMIC employing a novel chip-size package

IEEE Transactions on Microwave Theory and Techniques

Volumn 50, Issue 12, 2002, Pages 2930-2937

  Yun, Young ^a   Nishijima, Masaaki ^a   Katsuno, Motonari ^a   Ishida, Hidetoshi ^a   Minagawa, Katsuya ^a   Nobusada, Toshihide ^a   Tanaka, Tsuyoshi ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

Anisotropic conductive film (ACF); Broad band amplifier; Chip size package (CSP); Monolithic microwave integrated circuit; STO

Indexed keywords

BROADBAND AMPLIFIERS; CAPACITORS; CHIP SCALE PACKAGES; CONDUCTIVE FILMS;

ANISOTROPIC CONDUCTIVE FILMS (ACF);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0036906365     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2002.805284     Document Type: Article

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