Millimeter-wave ceramic package for a surface mount

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2000, Pages 61-64

  Koriyama, Shinichi ^a   Kitazawa, Kenji ^a   Shino, Naoyuki ^a   Minamiue, Hidehiro ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC LAMINATION TECHNOLOGY; ELECTROMAGNETIC COUPLING; MILLIMETER WAVE CERAMIC PACKAGE; MILLIMETER WAVE SIGNAL;

CERAMIC MATERIALS; ELECTROMAGNETIC FIELD THEORY; INSERTION LOSSES; INTEGRATED CIRCUIT MANUFACTURE; MICROSTRIP LINES; MILLIMETER WAVES; OPTIMIZATION; SPURIOUS SIGNAL NOISE; SURFACE MOUNT TECHNOLOGY;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033724427     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)

1. K. Nagata, T. Miyamoto and B. F. Miyagawa, "A study of VIA using for three-dimensional transmission line" Proc. of 1995 electronics SOC. cod. of EICE, C-326, September, 1995.
2. M. Radmanesh and B. Amold, "Generalized microstrip-slot transitions : Theory and simulation vs. experiment" Microwave Joumal, pp.88-95, June, 1993.