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Volumn 96, Issue 1 A, 1998, Pages 42-46
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Electroless nickel/immersion gold finishes for application to surface mount technology: a regenerative approach
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
BONDING;
ELECTRIC WIRE;
GOLD PLATING;
INSPECTION;
NICKEL PLATING;
PRINTED CIRCUIT BOARDS;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
ALUMINUM WIRE;
ELECTROLESS NICKEL PLATING;
GOLD WIRE;
ELECTROLESS PLATING;
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EID: 0031627825
PISSN: 00260576
EISSN: None
Source Type: Journal
DOI: 10.1016/s0026-0576(97)80243-7 Document Type: Article |
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Times cited : (16)
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References (0)
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