Electroless Deposition of Cu with Solutions Containing Either Mg2+ or Pd2+ Ions

Physica Scripta T

Volumn 79, Issue , 1999, Pages 232-235

  Mouroux, Aliette ^a   Zhang, Shi Li ^a   Palmans, Roger ^b   Min, Woo Sig ^b   Maex, Karen ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012283415     PISSN: 02811847     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)

1. Geppert, L., IEEE Spectrum 35, 23 (1998).
2. Torres, J., Appl. Surf. Sci. 91, 112 (1995).
3. Ting, C. H. and Paunovic, M., J. Electrochem. Soc. 136, 456 (1989).
4. Dubin, V. M., Shacham-Diamond, Y., Zhao, B., Vasudev, P. K. and Ting, C. H., J. Electrochem. Soc. 144, 898 (1997).