Copper wetting of a tetrasulfide self-assembled monolayer

Electrochemical and Solid-State Letters

Volumn 5, Issue 10, 2002, Pages

  Senkevich, Jay J ^a   Li, Boquan ^a   Yang, G R ^a   Wang, G C ^a   Lu, T M ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; CHEMICAL BONDS; FILM GROWTH; MONOLAYERS; OXIDATION; SELF ASSEMBLY; STRUCTURE (COMPOSITION); SULFUR COMPOUNDS; THIN FILMS; THREE DIMENSIONAL; WETTING;

BOND ENERGY; COPPER WETTING; MERCAPTAN MOIETY; TETRASULFIDE;

COPPER;

EID: 0036795154     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1504902     Document Type: Article

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