Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

Semiconductor Science and Technology

Volumn 17, Issue 9, 2002, Pages 911-917

  Lu, Haijing ^a,b   Kang, Cheah Li ^a   Wong, Stephen C K ^a   Gong, Hao ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTROLESS PLATING; PRINTED CIRCUIT BOARDS; SILICON WAFERS;

WAFER BUMPING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036712979     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/17/9/302     Document Type: Article

References (10)