An experimental method for refinement of solderability measurement

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 14-21

  Liggett, W ^a   Moon, K W ^a   Handwerker, C ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; MANUFACTURE; MONITORING; PHYSICAL PROPERTIES; QUALITY ASSURANCE; QUALITY CONTROL; SIGNAL TO NOISE RATIO; SOLDERING; WETTING;

IN HOUSE REFINEMENT; PROTOCOL; SOLDERABILITY; STEAM AGEING; WETTING BALANCE; WETTING FORCE CURVE;

MECHANICAL VARIABLES MEASUREMENT;

EID: 0031189698     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919710195181     Document Type: Article

References (13)

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