Single chip bumping

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 633-638

  Klein, Matthias ^a   Oppermann, Hermann ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES; GOLD; PALLADIUM;

SINGLE CHIP BUMPING; SOLDERS; STUD BUMPING; THERMOSONIC BONDING;

ELECTRONICS PACKAGING;

EID: 0032315650     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)