Implementation of a chemical wafer bumping process

Proceedings of the International Electronics Packaging Conference

Volumn , Issue , 1995, Pages 354-366

  Ostmann, A ^a   Kloeser, J ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AGING OF MATERIALS; CERAMIC MATERIALS; CHEMICAL OPERATIONS; CONDUCTIVE MATERIALS; DIES; ELECTRIC WIRING; ELECTRODEPOSITION; FLIP CHIP DEVICES; NICKEL PLATING; SOLDERING; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE ADHESIVE; CHEMICAL WAFER BUMPING PROCESS; ELECTROLESS NICKEL DEPOSITION; FLIP CHIP SOLDERING; FLIP CHIP TECHNOLOGY; PRESSURE COOKER TEST; SOLDER PRINTING; THERMAL AGING;

ELECTRONICS PACKAGING;

EID: 0029452984     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)