Conductivity measurements at the interface between the sintered conductor and dielectric substrate at microwave frequencies

IEEE Transactions on Microwave Theory and Techniques

Volumn 50, Issue 7, 2002, Pages 1665-1674

  Nakayama, Akira ^b   Terashi, Yoshitake ^b   Uchimura, Hiroshi ^b   Fukuura, Atsuomi ^a,b  

^a IEEE

^b KYOCERA CORPORATION   (Japan)

Author keywords

Complex permittivity; Dielectric rod resonator; Glass ceramic substrate; Interface conductivity; Microwave measurement; Sapphire; Sintered copper

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTIVITY MEASUREMENT; FREQUENCIES; GLASS CERAMICS; INTERFACES (MATERIALS); PERMITTIVITY; RESONATORS; SAPPHIRE; SINTERING; SUBSTRATES;

DIELECTRIC SUBSTRATES;

MICROWAVE MEASUREMENT;

EID: 0036646969     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2002.800382     Document Type: Article

References (13)

1. Complex permittivity measurement of dielectric plates by a cavity resonance method
2. Improved cavity resonance method for nondestructive measurement of complex permittivity of dielectric plate
3. Nondestructive permittivity measurement of substrates
4. The gap correction for the resonant-mode dielectrometer
5. A measurement method of complex permittivity at pseudo micro wave frequency using a cavity resonator filled with dielectric material
6. Complex permittivity measurement at pseudo microwave frequency using a dielectric-plate-loaded cavity resonator
7. Dielectric characterization of low-loss materials, a comparison of techniques
8. Precise measurements of dissipation factor in microwave printed circuit boards
9. Single-crystal dielectric resonators for low-temperature electronics applications
10. A dielectric resonator method of measuring inductive capacities in the millimeter range
11. Microwave measurement of dielectric properties of low-loss materials by the dielectric rod resonator method
12. Round robin test on a dielectric resonator method for measuring complex permittivity at microwave frequency
13. Development of material for multilayer ceramic substrate with copper wiring in millimeter wave applications