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Volumn 61, Issue 1-3, 1997, Pages 379-386

Microstructuring of silicon by electro-discharge machining (edm) -part ii: Applications

Author keywords

Electro discharge machining; Microelectromechanical system (MEMS); Silicon micromachining

Indexed keywords

MICROMACHINING; SEMICONDUCTING SILICON;

EID: 0031167757     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80293-2     Document Type: Article
Times cited : (41)

References (19)
  • 3
  • 5
    • 30244535832 scopus 로고
    • Micro electro-discharge machining technologies
    • T. Masaki, Micro electro-discharge machining technologies, National Technical Report, 39 (1993) 33-39.
    • (1993) National Technical Report , vol.39 , pp. 33-39
    • Masaki, T.1
  • 7
    • 0025888123 scopus 로고
    • Development of a pocket-size electro-discharge machine
    • T. Higuchi, K. Furutani, Y. Yamagata and K. Takeda, Development of a pocket-size electro-discharge machine, Annals CIRP, 40 (1991) 203-205.
    • (1991) Annals CIRP , vol.40 , pp. 203-205
    • Higuchi, T.1    Furutani, K.2    Yamagata, Y.3    Takeda, K.4
  • 8
    • 30244484281 scopus 로고    scopus 로고
    • Microstructuring of silicon by electro-discharge machining (EDM) part I: Theory
    • this volume
    • D. Reynaerts, P.-H. 's Heeren, H. Van Brussel, Microstructuring of silicon by electro-discharge machining (EDM) part I: theory, Sensors and Actuators A, this volume.
    • Sensors and Actuators A
    • Reynaerts, D.1    'S Heeren, P.-H.2    Van Brussel, H.3
  • 9
    • 0006506850 scopus 로고
    • Investigation of silicon wafering by wire EDM
    • Y.F. Luo, C.G. Chen and Z.F. Tong, Investigation of silicon wafering by wire EDM, J. Mater. Sci., 27 (1992) 5805-5810.
    • (1992) J. Mater. Sci. , vol.27 , pp. 5805-5810
    • Luo, Y.F.1    Chen, C.G.2    Tong, Z.F.3
  • 11
    • 0029210098 scopus 로고    scopus 로고
    • Modular method for microparts machining and assembly with self-alignment
    • H.H. Langen, T. Masuzawa and M. Fujino, Modular method for microparts machining and assembly with self-alignment, Annals CIRP, 44 (1995) 173-176.
    • (1995) Annals CIRP , vol.44 , pp. 173-176
    • Langen, H.H.1    Masuzawa, T.2    Fujino, M.3
  • 13
    • 30244481980 scopus 로고
    • Semiconducting wafer form shaping with an electric discharge machine
    • Y.-T. Yang, Semiconducting wafer form shaping with an electric discharge machine, Rev. Sci. Instrum., 59 (1988) 2094-2096.
    • (1988) Rev. Sci. Instrum. , vol.59 , pp. 2094-2096
    • Yang, Y.-T.1
  • 14
    • 0022935691 scopus 로고
    • Current trends in non conventional removal processes
    • R. Snoeys, F. Staelens and W. Dekeyser, Current trends in non conventional removal processes, Annals CIRP, 35 (1986) 467-480.
    • (1986) Annals CIRP , vol.35 , pp. 467-480
    • Snoeys, R.1    Staelens, F.2    Dekeyser, W.3
  • 18
    • 0029429020 scopus 로고
    • Fabrication of 45° mirrors together with well-defined V-grooves using wet anisotropic etching of silicon
    • C. Strandman, L. Rosengren, H. Elderstig and Y. Backlund, Fabrication of 45° mirrors together with well-defined V-grooves using wet anisotropic etching of silicon, J. Microelectromech. Syst., 4 (1995) 213-219.
    • (1995) J. Microelectromech. Syst. , vol.4 , pp. 213-219
    • Strandman, C.1    Rosengren, L.2    Elderstig, H.3    Backlund, Y.4
  • 19
    • 0028407817 scopus 로고
    • Extremely miniturized capacitive movement sensors using new suspension systems
    • B. Puers and D. Lapadatu, Extremely miniturized capacitive movement sensors using new suspension systems, Sensors and Actuators A, 41-42 (1994) 129-135.
    • (1994) Sensors and Actuators A , vol.41-42 , pp. 129-135
    • Puers, B.1    Lapadatu, D.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.