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Volumn 43, Issue 7, 2002, Pages 1621-1623
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Increase in electrical resistivity of copper and aluminum fine lines
a
a
HITACHI LTD
(Japan)
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Author keywords
Copper aluminum thin film fine line; Electric resistivity; Electron mean free path; Film thickness; Line width
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Indexed keywords
ALUMINUM;
COPPER;
ELECTRIC CONDUCTIVITY;
ELECTRIC RESISTANCE;
SCANNING ELECTRON MICROSCOPY;
THIN FILMS;
TRANSMISSION ELECTRON MICROSCOPY;
ALUMINUM FINE LINES;
ELECTRIC LINES;
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EID: 0036630667
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.43.1621 Document Type: Article |
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Times cited : (45)
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References (8)
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