Effect of thiourea and saccharin on the roughness of electrodeposited ultrathin nickel and cobalt layers

Journal of Applied Electrochemistry

Volumn 32, Issue 6, 2002, Pages 621-627

  Renner, R F ^a   Liddell, K C ^a  

^a Washington State University   (United States)

Author keywords

Cobalt; Nickel; Saccharin; Surface roughness; Thiourea

Indexed keywords

ADDITIVES; ATOMIC FORCE MICROSCOPY; COBALT; DENSITY (SPECIFIC GRAVITY); ELECTRODEPOSITION; MORPHOLOGY; NICKEL; ORGANIC COMPOUNDS; ROUGHNESS MEASUREMENT; SURFACE ROUGHNESS;

AREAL PEAK DENSITY; FILM THICKNESS; PLATING BATHS; ROOT MEAN SQUARE PEAK HEIGHT; SACCHARIN; THIOUREA;

ULTRATHIN FILMS;

EID: 0036622966     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020174020887     Document Type: Article

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