Application of spectral methods to thermal analysis of nanoscale electronic devices

Numerical Heat Transfer; Part A: Applications

Volumn 41, Issue 6-7, 2002, Pages 711-724

  Ilegbusi, Olusegun J ^a   Coşkun, A Ümit ^a   Yener, Yaman ^a  

^a NORTHEASTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOSFET DEVICES; NANOSTRUCTURED MATERIALS; PHONONS; SILICON; SPECTRUM ANALYSIS; THERMOANALYSIS; TRANSIENTS;

PHONON SCATTERING;

ELECTRONIC EQUIPMENT;

EID: 0036574061     PISSN: 10407782     EISSN: None     Source Type: Journal    
DOI: 10.1080/104077802317418313     Document Type: Conference Paper

References (14)

1. Quantum transistors toward nanoelectronics
2. Microscale heat conduction in dielectric thin film
3. Temperature-dependent thermal conductivity of single crystal silicon layers in SOI substrates
4. Phonon scattering in silicon films with thickness of order 100 nm
5. Microscale heat transport phenomena
6. Heat waves
7. A form of heat conduction which eliminates the paradox of instantaneous propagation
8. Hyperbolic heat conduction equation - A solution for the semi-infinite body problem
9. Solution of the linearized phonon Boltzman equations
10. Non-isothermal device simulation of gate switching and Drain Breakdown characteristics of Si MOSFET in transient state
11. Thermal resistance due to point defects at high temperatures