Design on semiconductor coupled SAW convolver

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 49, Issue 4, 2002, Pages 466-474

  Hohkawa, Kohji ^a,b   Suda, Takaya ^b   Aoki, Yusuke ^b   Hong, Chulun ^b   Kaneshiro, Chinami ^b   Koh, Keishin ^b  

^a IEEE   (Japan)

^b KANAGAWA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONVOLVERS;

ACOUSTIC WAVE TRANSMISSION; CONVOLUTION; ELECTRODES; PIEZOELECTRIC MATERIALS; SEMICONDUCTOR DIODES; SUBSTRATES;

ACOUSTIC SURFACE WAVE DEVICES;

ARTICLE;

EID: 0036525631     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/58.996565     Document Type: Article

References (15)

1. SAW devices in wireless communication
2. 3 MIS structure
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4. Basic characteristics of surface acoustic-wave convolver in monolithic MIS structure
5. Theory of strip coupled acoustic devices
6. High efficient electro-acoustic convolvers
7. 3 substrates
8. Van der Waals bonding of GaAs epitaxial lift off films onto arbitrary substrates
9. Surface acoustic wave semiconductor coupled devices employing epitaxial lift-off film bonding process
10. Analysis of interdigital transducers
11. Simulation study on semiconductor coupled SAW convolver through multi strip
12. SAW-semiconductor coupled device striped semiconductor films
13. Fabrication of surface acoustic wave-semiconductor coupled device using epitaxial lift-off process
14. 3 structure using film bonding process