Electromigration in nanometer Al-Cu interconnect lines

Journal of the Electrochemical Society

Volumn 149, Issue 2, 2002, Pages

  Pang, Xun ^a   Kriman, Alfred M ^a   Bernstein, Gary H ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS; CURRENT DENSITY; ELECTRON BEAMS; EVAPORATION; MICROSTRUCTURE;

NANOMETER INTERCONNECT LINES;

ELECTROMIGRATION;

EID: 0036476436     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1430229     Document Type: Article

References (20)