Investigation of the thermal degradation mechanism for Cu/Au Schottky contacts to the InGaP layer

Journal of Applied Physics

Volumn 91, Issue 3, 2002, Pages 1349-1353

  Liu, Day Shan ^a   Lee, Ching Ting ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CROSS SECTIONAL TRANSMISSION ELECTRON MICROSCOPY; CROSS-SECTIONAL MICROSTRUCTURE; CU ELEMENT; CU LAYERS; CURRENT-VOLTAGE MEASUREMENTS; DIFFRACTION PEAKS; EDS MEASUREMENTS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; INTERMETALLIC LAYER; SCHOTTKY CONTACTS; THERMAL DEGRADATION MECHANISM; XRD MEASUREMENTS;

DEGRADATION; DIFFRACTION; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY SPECTROSCOPY;

GOLD;

EID: 0036469580     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1428789     Document Type: Article

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