Adhesion and progressive debonding of polymer/metal interfaces: Effects of temperature and environment

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 263-268

  Kook, Seung Yeop ^a   Kirtikar, Amol ^b   Dauskardt, Reinhold H ^a  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ANALYSIS; ADHESION; COPPER; DELAMINATION; INTERFACIAL ENERGY; MATHEMATICAL MODELS; POLYELECTROLYTES; REACTION KINETICS; RELAXATION PROCESSES; THERMAL EFFECTS;

CHEMICAL REACTION RATE THEORY; INTERFACIAL FRACTURE ENERGY;

ELECTRIC CONTACTS;

EID: 0033284879     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-263     Document Type: Article

References (10)

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