Progressive debonding of multilayer interconnect structures

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 21-26

  Lane, Michael ^a   Ware, Robert ^a   Voss, Steven ^a   Ma, Qing ^a   Fujimoto, Harry ^a   Dauskardt, Reinhold H ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM ALLOYS; CRACK PROPAGATION; DUCTILITY; MORPHOLOGY; MULTILAYERS; SILICA; THIN FILMS; TITANIUM NITRIDE;

INTERFACIAL DEBONDING; MULTILAYER INTERCONNECTS;

INTERFACES (MATERIALS);

EID: 0031357479     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-21     Document Type: Conference Paper

References (11)