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Volumn 22, Issue 4, 2002, Pages 323-329
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Use of an electrochemical probe for predictive assessment of bonded repair
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
ELECTROCHEMISTRY;
EQUIVALENT CIRCUITS;
MOISTURE;
PROBES;
SENSORS;
SPECTROSCOPY;
ELECTROCHEMICAL PROBES;
BOND STRENGTH (CHEMICAL);
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EID: 0036337232
PISSN: 01437496
EISSN: None
Source Type: Journal
DOI: 10.1016/S0143-7496(02)00011-8 Document Type: Article |
Times cited : (15)
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References (48)
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