Monitoring adhesive bond integrity with electrochemical impedance spectroscopy

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 41, Issue 1, 1996, Pages 544-552

  Davis, G D ^a   Whisnant, P L ^a   Wolff Jr , J P ^a  

^a LOCKHEED MARTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AIRCRAFT MATERIALS; CORROSION; DEGRADATION; DELAMINATION; ELECTROCHEMICAL ELECTRODES; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); MONITORING; NONDESTRUCTIVE EXAMINATION; SPECTROSCOPY;

ALUMINUM JOINTS; BOND FAILURE; BONDLINE; INTERFACIAL DEGRADATION; MONITORING ADHESIVE BOND INTEGRITY;

BOND STRENGTH (MATERIALS);

EID: 0029709252     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)