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Volumn 35, Issue 6, 2000, Pages 1331-1337

Non destructive evaluation of adhesively bonded composite structures using high frequency dielectric spectroscopy

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; COMPOSITE STRUCTURES; CORRELATION METHODS; ELECTRIC CONDUCTIVITY OF SOLIDS; INTERFACES (MATERIALS); NONDESTRUCTIVE EXAMINATION; SPECTROSCOPIC ANALYSIS; STRUCTURAL ANALYSIS; TIME DOMAIN ANALYSIS;

EID: 0033903145     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004717704215     Document Type: Article
Times cited : (26)

References (15)
  • 6
    • 0342641449 scopus 로고
    • edited by A. J. Kinloch Applied Science Publishers
    • J. COMYN, in "Developments in Adhesives - Part 2," edited by A. J. Kinloch (Applied Science Publishers, 1981).
    • (1981) Developments in Adhesives - Part 2 , vol.2
    • Comyn, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.