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Volumn 16, Issue 10, 2002, Pages 1307-1326
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Inspection of composite and metal adhesive bonds with an electrochemical sensor
a
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Author keywords
Adhesive bond; Composite; Condition based maintenance; Degradation; Electrochemical impedance spectroscopy; Inspection; Moisture; Sensor
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Indexed keywords
ALUMINUM;
BOND STRENGTH (MATERIALS);
DEGRADATION;
ELECTROCHEMICAL SENSORS;
EPOXY RESINS;
GLASS;
GRAPHITE;
INSPECTION;
MOISTURE;
POLYESTERS;
SPECTROSCOPY;
TEMPERATURE;
BOND (MASONRY);
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
GRAPHITE EPOXY COMPOSITES;
MAINTENANCE;
SENSORS;
ADHESIVE BONDS;
LAP SHEAR TESTS;
WEDGE TESTS;
ADHESION;
MOISTURE CONTROL;
ADHESIVE BOND;
BONDED STRUCTURE;
BONDLINE THICKNESS;
CIRCUIT CAPACITANCE;
CIRCUIT PARAMETER;
COMPOSITE;
CONDITION BASED MAINTENANCE;
ELECTRIC CIRCUIT;
ELECTROCHEMICAL IMPEDANCE;
GLASS COMPOSITES;
GLASS/EPOXY;
GLASS/POLYESTER;
GLASS/VINYLESTER COMPOSITES;
HIGH HUMIDITY;
IMPEDANCE SPECTRUM;
IN-SITU;
LAP SHEAR TESTS;
MOISTURE ABSORPTION;
PREVENTATIVE ACTIONS;
SATURATION LEVELS;
SENSOR ELECTRODES;
TEMPERATURE CONDITIONS;
WEDGE TEST;
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EID: 0036075853
PISSN: 01694243
EISSN: None
Source Type: Journal
DOI: 10.1163/156856102320252822 Document Type: Article |
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Times cited : (22)
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References (25)
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