Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

Applied Optics

Volumn 41, Issue 2, 2002, Pages 348-360

  Li, Guoqiang ^a,b   Huang, Dawei ^a   Yuceturk, Emel ^a   Marchand, Philippe J ^a   Esener, Sadik C ^a   Ozguz, Volkan H ^c   Liu, Yue ^d  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b SHANGHAI INSTITUTE OF OPTICS AND FINE MECHANICS   (China)

^c SUN MICROSYSTEMS   (United States)

^d HONEYWELL TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CHIP SCALE PACKAGES; CROSSTALK; LIGHT REFLECTION; MICROELECTRONICS; MICROOPTICS; MICROPROCESSOR CHIPS; MIRRORS; OPTICAL INTERCONNECTS; OPTICAL SYSTEMS; SEMICONDUCTING SILICON; SOLID STATE LASERS; SWITCHING SYSTEMS; VLSI CIRCUITS;

OPTOELECTRONIC STACKED PROCESSORS;

OPTOELECTRONIC DEVICES;

EID: 0036303403     PISSN: 1559128X     EISSN: 21553165     Source Type: Journal    
DOI: 10.1364/AO.41.000348     Document Type: Article

References (36)

1. J. W. Goodman, F. I. Leonberger, S.-Y. Kung, and R. A. Athale, “Optical interconnections for VLSI systems, ” Proc. IEEE 72, 850-866 (1984).
2. H. S. Hinton, T. J. Cloonan, F. B. McCormick, A. L. Lentine, and F. A. P. Tooley, “Free-space digital optical systems, ” Proc. IEEE 82, 1632-1649 (1994).
3. D. A. B. Miller, “Physical reasons for optical interconnection, ” Int. J. Optoelectron. 11, 155-168 (1997).
4. G. I. Yayla, P. J. Marchand, and S. C. Esener, “Speed and energy analysis of digital interconnections: comparison of on-chip, off-chip, and free-space technologies, ” Appl. Opt. 37, 205-227 (1998).
5. A. L. Lentine, K. W. Goosen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS, ” IEEE J. Sel. Top. Quantum Electron. 2, 77-84 (1996).
6. A. V. Krishnamoorthy, L. M. F. Chirovsky, W. S. Hobson, R. E. Leibenguth, S. P. Hui, G. J. Zydzik, K. W. Goosen, J. D. Wynn, B. J. Tseng, J. Lopata, J. A. Walker, J. E. Cunningham, and L. A. D’Asaro, “Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits, ” IEEE Photon. Technol. Lett. 11, 128-130 (1999).
7. A. W. Lohmann, “Image formation of dilute arrays for optical information processing, ” Opt. Commun. 86, 365-370 (1991).
8. F. A. P. Tooley, “Challenges in optically interconnecting electronics, ” IEEE J. Sel. Top. Quantum Electron. 2, 3-13 (1996).
9. F. B. McCormic, F. A. P. Tooley, T. J. Cloon, J. M. Sasian, and H. S. Hinton, “Optical interconnects using microlens arrays, ” Opt. Quantum Electron. 24, 465-477 (1992).
10. R. K. Kostuk, J. W. Goodman, and L. Hesselink, “Optical imaging applied to microelectronic chip-to-chip interconnections, ” Appl. Opt. 24, 2851-2858 (1985).
11. D. V. Plant, B. Robertson, H. S. Hinton, M. H. Ayliffe, G. C. Boisset, W. Hsiao, D. Kabal, N. H. Kim, Y. S. Liu, M. R. Otazo, D. Pavlasek, A. Z. Shang, J. Simmons, K. Song, D. A. Thompson, and W. M. Robertson, “4 X 4 vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) optical backplane demonstrator system, ” Appl. Opt. 35, 6365-6368 (1996).
12. X. Zheng, P. J. Marchand, D. Huang, and S. Esener, “Freespace parallel multichip interconnection system, ” Appl. Opt. 39, 3516-3524 (2000).
13. M. W. Haney, M. P. Christensen, P. Milojkovic, J. Ekman, P. Chandramani, R. Rozier, F. Kiamilev, Y. Liu, and M. Hibbs-Brenner, “Multichip free-space global optical interconnection demonstration with integrated arrays vertical-cavity surface-emitting lasers and photodetectors, ” Appl. Opt. 38, 6190-6200 (1999).
14. N. McArdle, M. Naruse, and M. Ishikawa, “Optoelectronic parallel computing using optically interconnected pipeline processing arrays, ” IEEE J. Sel. Top. Quantum Electron. 5, 250-260 (1999).
15. E. M. Strzelecka, D. A. Louderback, B. J. Thibeault, G. B. Thompson, K. Bertilsson, and L. A. Coldren, “Parallel freespace optical interconnect based on arrays of vertical-cavity lasers and detectors with monolithic microlens, ” Appl. Opt. 37, 2811-2821 (1998).
16. Y. Li, T. Wang, and R. A. Linke, “VCSEL-array-based angle-multiplexed optoelectronic crossbar interconnects, ” Appl. Opt. 35, 1282-1295 (1996).
17. C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, and S. Esener, “Parallel distributed free-space optoelectronic computer engine using flat “plug-on-top” optics package, ” in Optics in Computing 2000, R. A. Lessard and T. Galstian, eds., Proc. SPIE 4089, 1037-1045 (2000).
18. G. Li, D. Huang, E. Yuceturk, M. M. Wang, C. Berger, S. C. Esener, Y. Liu, and V. H. Ozguz, “Free-space optical interconnection for three-dimensional stacked VLSI chips, ” in Technical Digest of Optics in Computing (Optical Society of America, Washington, D.C., 2001), pp. 144-146.
19. S. Sinzinger and J. Jahns, “Integrated micro-optical imaging system with a high interconnection capacity fabricated in planar optics, ” Appl. Opt. 36, 4729-4735 (1997).
20. G. J. Simonis, L. Jiang, B. Koley, M. Dagenais, J. Mait, P. Newman, B. Lawler, W. Chang, P. Shen, M. Taysing-Lara, and M. Datta, “Research on VCSEL interconnect and OE processing research at Army Research Laboratory, ” in Vertical-Cavity Surface-Emitting Lasers IV, K. D. Choquette and C. Lei, eds., Proc. SPIE 3946, 172-186 (2000).
21. Y. S. Liu, B. Robertson, D. V. Plant, H. S. Hinton, and W. M. Robertson, “Design and characterization of a microchannel optical interconnect for optical backplanes, ” Appl. Opt. 36, 3127-3141 (1997).
22. Y. Li, J. Ai, and J. Popelek, “Board-level 2-D data-capable optical interconnection circuits using polymer fiber-image guides, ” Proc. IEEE 88, 794-805 (2000).
23. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, and M. K. Hibbs-Brenner, “Fully embedded board-level guided-wave optoelectronic interconnects, ” Proc. IEEE 88, 780-793 (2000).
24. F. Quercioli, B. Tiribilli, A. Mannoni, and S. Acciai, “Optome-chanics with LEGO, ” Appl. Opt. 37, 3408-3416 (1998).
25. D. Miyazaki, S. Masuda, and K. Matsushita, “Self-alignment with optical microconnectors for free-space optical interconnections, ” Appl. Opt. 37, 228-232 (1998).
26. D. T. Neilson and E. Schenfeld, “Plastic modules for free-space optical interconnects, ” Appl. Opt. 37, 2944-2952 (1998).
27. K. H. Brenner, M. Kufner, S. Kunfer, J. Moisel, A. Muller, S. Sinzinger, M. Testorf, J. Gottert, and J. Mohr, “Application of three-dimensional micro-optical components formed by lithography, electroforming and plastic molding, ” Appl. Opt. 32, 6464-6469 (1993).
28. S. Esener and P. Marchand, “3D optoelectronic stacked processors: design and analysis, ” in Optics in Computing’98, P. H. Chavel, D. A. Miller, and H. Thienpont, Proc. SPIE 3490, 541-545 (1998).
29. P. J. Marchand, A. V. Krishnamoorthy, G. I. Yayla, S. C. Esener, and U. Efron, “Optically augmented 3-D computer: system technology and architecture, ” J. Parallel Distrib. Com-put. 41, 20-35 (1997).
30. D. Huang, G. Li, E. Yuceturk, M. M. Wang, C. Berger, X. Zheng, P. J. Marchand, and S. C. Esener, “3D optical interconnect distributed crossbar switching architecture, ” in Technical Digest of Optics in Computing (Optical Society of America, Washington, D.C., 2001), pp. 141-143.
31. B. P. Barrett, P. Blair, G. S. Buller, D. T. Neilson, B. Robertson, E. C. Smith, M. R. Taghizadeh, and A. C. Walker, “Components for the implementation of free-space optical crossbars, ” Appl. Opt. 35, 6934-6944 (1996).
32. A. C. Walker, M. P. Y. Desmulliez, M. G. Forbes, S. J. Fancey, G. S. Buller, M. R. Taghizadeh, J. A. B. Dines, C. R. Stanley, G. Pennelli, A. R. Boyd, P. Horan, D. Byrne, J. Hegarty, S. Eitel, H.-P. Gauggel, K.-H. Gulden, A. Gauthier, P. Benabes, J.-Louis Gutzwiller, and M. Goetz, “Design and construction of an optoelectronic crossbar switch containing a Terabit per second free-space optical interconnect, ” IEEE J. Sel. Top. Quantum Electron. 5, 236-247 (1999).
33. A. O. Harris, “Multichannel acousto-optic crossbar switch, ” Appl. Opt. 30, 4245-4256 (1991).
34. E. Chiou and P. Yeh, “2 X 8 photorefractive reconfigurable interconnect with laser diodes, ” Appl. Opt. 31, 5536-5541 (1992).
35. B. Webb and A. Louri, “All-optical crossbar switch using wavelength division multiplexing and vertical-cavity surface-emitting lasers, ” Appl. Opt. 38, 6176-6183 (1999).
36. Optical Research Associates, 3280 East Foothill Boulevard, Suite 300, Pasadena, Calif. 91107.