Stress relaxation behavior of 3501-6 epoxy resin during cure

Polymer Engineering and Science

Volumn 36, Issue 23, 1996, Pages 2852-2862

  Kim, Yeong K ^a,b   White, Scott R ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b Korean Air   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; GELATION; MATHEMATICAL MODELS; STRESS RELAXATION; VISCOELASTICITY;

CONSTITUTIVE MODEL; CURING DEGREE; DYNAMIC MECHANICAL ANALYZER; MASTER CURVES; RELAXATION MODULUS; RELAXATION TIME;

EPOXY RESINS;

EID: 0030379041     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10686     Document Type: Article

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