Development of a novel carbon based material for integrated passive application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 510-515

  Cheah, L K ^a   Wong, Stephen ^a   Tay, B K ^b   Sheeja, D ^b   Shi, X ^c   Lee, S W ^b   Hoy, M L ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c Nanofilm Technol Intl PTE Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS FILMS; ATOMIC FORCE MICROSCOPY; DEPOSITION; ELECTRIC CONDUCTIVITY; ETCHING; ION BEAMS; METALLIZING; PARTIAL PRESSURE; PASSIVE NETWORKS; RESISTORS; SURFACE ROUGHNESS; THIN FILM DEVICES; VACUUM APPLICATIONS;

THIN FILM RESISTORS;

CARBON;

EID: 0036292617     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008144     Document Type: Article

References (11)

1. Standard method for measuring and using the temperature coefficient of rsistance to determine the temperature of a metallization line