New generation quasi-monolithic integration technology (QMIT)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 641-645

  Joodaki, Mojtaba ^a   Kompa, Günter ^a   Hillmer, Hartmut ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FABRICATION; MICROSTRIP LINES; MICROWAVE CIRCUITS; SILICON; THERMAL STRESS;

QUASI-MONOLITHIC INTEGRATION TECHNOLOGY (QMIT);

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0036292429     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. GaAs FET characterization in a quasi-monolithic Si environment
2. Simulation and measurement of thermal stress in quasi-monolithic integration technology (QMIT)
3. Heat transfer and thermal stress analysis in the new generation of quasi-monolithic integration technology
4. Passive elements in the new generation of quasi-monolithic integration technology
5. Optimization of thermal resistance in quasi-monolithic integration technology (QMIT) structure