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Volumn , Issue , 2000, Pages 161-166
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Approaches on compact component thermal models and a few related topics
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
BOUNDARY CONDITIONS;
FINITE ELEMENT METHOD;
HEAT FLUX;
PRINTED CIRCUIT BOARDS;
SEMICONDUCTOR DEVICE MODELS;
THERMOANALYSIS;
COMPACT COMPONENT THERMAL MODELS (CCTM);
ELECTRONICS PACKAGING;
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EID: 0033748593
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (6)
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References (2)
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