Reliability and routability consideration for MCM placement

Microelectronics Reliability

Volumn 42, Issue 1, 2002, Pages 83-91

  Huang, Yu Jung ^a   Guo, Mei Hui ^b   Fu, Shen Li ^a  

^a I SHOU UNIVERSITY   (Taiwan)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FUZZY SETS; RELIABILITY; SUBSTRATES;

POWER DISSIPATING CHIPS;

MULTICHIP MODULES;

EID: 0036133357     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00228-1     Document Type: Article

References (19)

1. Design of multichip modules
2. Component-placement optimization for convectively cooled electronics
3. Component placement for reliability on conductively cooled printed wiring boards
4. Placement for reliability and routability of convectively cooled PWB's
5. Reliability and wireability optimizations for module placement on convectively cooled printed wiring board
6. Optimal three-dimensional placement of heat generating electronic components
7. A matrix synthesis approach to thermal placement
8. Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards
9. Thermal placement design for MCM applications
10. A forced directed component placement procedure for printed circuit boards
11. Fuzzy logic based thermal design for MCM placement
12. Thermal placement in MCM design
13. Low power considerations in floorplan design