Optimal three-dimensional placement of heat generating electronic components

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 106-113

  Campbell, M I ^a   Amon, C H ^a   Cagan, J ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; HEAT TRANSFER; SIMULATED ANNEALING;

ELECTRONIC COMPONENT LAYOUT; THREE DIMENSIONAL COMPONENT PLACEMENT;

ELECTRONICS PACKAGING;

EID: 0031166024     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792210     Document Type: Article

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