Computational modeling techniques for reliability of electronic components on printed circuit boards

Applied Numerical Mathematics

Volumn 40, Issue 1-2, 2002, Pages 101-117

  Bailey, C ^a   Lu, H ^a   Wheeler, D ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Electronic product assembly; Level set method; Multiphysics modeling; Solidification

Indexed keywords

COMPUTER SIMULATION; ELECTRONIC EQUIPMENT TESTING; FATIGUE OF MATERIALS; FINITE VOLUME METHOD; HEAT TRANSFER; RELIABILITY; SOLIDIFICATION; THERMOANALYSIS;

ELECTRONIC CHIP COMPONENTS;

PRINTED CIRCUIT BOARDS;

EID: 0036133264     PISSN: 01689274     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9274(01)00065-4     Document Type: Conference Paper

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