Numerical modelling of solder joint formation

Soldering and Surface Mount Technology

Volumn 10, Issue 2, 1998, Pages 6-13

  Bailey, Chris ^a   Wheeler, Daniel ^b   Cross, Mark ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACKING (CHEMICAL); DEFORMATION; FURNACES; PRINTED CIRCUIT BOARDS; SOLIDIFICATION; STRESS ANALYSIS; DEFECTS; MATHEMATICAL MODELS; PRINTED CIRCUIT MANUFACTURE; STRESS CONCENTRATION;

ASSEMBLY PROCESS; FLUX ENTRAPMENT; PITCH SIZES; VOID FORMATION; SOLDER JOINT FORMATION;

SOLDERED JOINTS;

EID: 0032067113     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919810219912     Document Type: Article

References (15)

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