A novel process for fabricating slender and compliant suspended poly-Si micro-mechanical structures with sub-micron gap spacing

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 661-664

  Pamidighantam, S ^a   Laureyn, W ^a   Salah, A ^a   Verbist, A ^a   Tilmans, H A C ^a  

^a IMEC   (Belgium)

Author keywords

Compliance; Contact angle; DTS; MEMS; SAM; Slendernes ratio; Stiction; Surface micromachining; Work of adhesion

Indexed keywords

BUILT-IN SELF TEST; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; POLYSILICON;

ANTI-STICTION MATERIAL; POLYCRYSTALLINE SILICON GERMANIUM TEST STRUCTURES; POLYSILICON MICROMECHANICAL STRUCTURES; SELF ASSEMBLED MONOLAYER; SUBMICRON GAP SPACING;

MICROELECTRONIC PROCESSING;

EID: 0036118042     PISSN: 10846999     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEMSYS.2002.984357     Document Type: Article

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