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Volumn , Issue , 2002, Pages 433-434
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Electromigration threshold length effect in dual damascene copper-oxide interconnects
a
a
CEA GRENOBLE
(France)
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER OXIDES;
FAILURE ANALYSIS;
SCANNING ELECTRON MICROSCOPY;
STRESS ANALYSIS;
TENSILE STRESS;
COPPER-OXIDE INTERCONNECTS;
ELECTROMIGRATION;
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EID: 0036087148
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (11)
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