SCOPUS 정보 검색 플랫폼

Volumn 388, Issue 1-2, 2001, Pages 303-314

Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching

(19) Filippi, R G a Gribelyuk, M A a Joseph, T a Kane, T a Sullivan, T D a Clevenger, L A b Costrini, G b Gambino, J b Iggulden, R C b Kiewra, E W b Ning, X J b Ravikumar, R b Schnabel, R F b Stojakovic, G b Weber, S J b Gignac, L M c Hu, C K c Rath, D L c Rodbell, K P c

a IBM MICROELECTRONICS (United States)

b IBM RESEARCH (United States)

c IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

Aluminum; Electromigration; Interfaces; Metallization

Indexed keywords

ALUMINUM COPPER ALLOYS; BACKSCATTERING; BINARY ALLOYS; CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY;

DUAL DEMASCENE PROCESS;

METALLIC FILMS;

EID: 0035372052 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(01)00855-0 Document Type: Article

Times cited : (10)

References (23)

1
- 85056552457
- June
- (1991) Proceedings of the VLSI Multilevel Interconnection Conference , pp. 144
- Kaanta, C.W.¹ Bombardier, S.G.² Cote, W.J.³ Hill, W.R.⁴ Kerszykowski, G.⁵ Landis, H.S.⁶ Poindexter, D.J.⁷ Pollard, C.W.⁸ Ross, G.H.⁹ Ryan, J.G.¹⁰ Wolff, S.¹¹ Cronin, J.E.¹²

4
- 0001988394
- June
- (1995) Proceedings of the VLSI Multilevel Interconnection Conference , pp. 596
- Licata, T.¹ Okazaki, M.² Ronay, M.³ Landers, W.⁴ Ohiwa, T.⁵ Poetzlberger, H.⁶ Aochi, H.⁷ Dobuzinsky, D.⁸ Filippi, R.⁹ Restaino, D.¹⁰ Knorr, D.¹¹ Ryan, J.¹²

5
- 0005354812
- June
- (1998) Proceedings of the International Interconnect Technology Conference , pp. 110
- Proost, J.¹ Li, H.² Brijs, B.³ Witvrouw, A.⁴ Maex, K.⁵

6
- 0005363144
- Conf. Proc. 491 AIP, New York
- (1999) Fifth International Workshop on Stress-Induced Phenomena in Metallization , pp. 27
- Schnabel, R.F.¹ Filippi, R.² Gignac, L.M.³ Rodbell, K.P.⁴ Hurd, J.L.⁵ Hu, C.-K.⁶ Clevenger, L.A.⁷ Weber, S.J.⁸ Iggulden, R.C.⁹ Ravikumar, R.¹⁰ Kiewra, E.W.¹¹ Kane, T.¹² Joseph, T.¹³ Wang, Y.Y.¹⁴

7
- 0028564567
- (1994) Mat. Res. Soc. Symp. Proc. , vol.343 , pp. 653
- Hurd, J.L.¹ Rodbell, K.P.² Knorr, D.B.³ Koligman, N.L.⁴

8
- 0001065090
- (1995) J. Appl. Phys. , vol.78 , pp. 3756
- Filippi, R.G.¹ Biery, G.A.² Wachnik, R.A.³

9
- 0001394880
- (1996) Appl. Phys. Lett. , vol.69 , pp. 2350
- Filippi, R.G.¹ Wachnik, R.A.² Aochi, H.³ Lloyd, J.R.⁴ Korhonen, M.A.⁵

10
- 36449002166
- (1993) J. Appl. Phys. , vol.74 , pp. 969
- Hu, C.-K.¹ Small, M.B.² Ho, P.S.³

11
- 0005284226
- (1993) Appl. Phys. Lett. , vol.62 , pp. 3273
- Oates, A.S.¹ Martin, E.P.² Alugbin, D.³ Nkansah, F.⁴

12
- 0001757030
- (1998) Appl. Phys. Lett. , vol.76 , pp. 326
- Hurd, J.L.¹ Rodbell, K.P.² Gignac, L.M.³ Clevenger, L.A.⁴ Iggulden, R.C.⁵ Schnabel, R.F.⁶ Weber, S.J.⁷ Schmidt, N.H.⁸

13
- 0010012007
- Proceedings ULSI XIII MRS, Pittsburgh, PA
- (1998) Advanced Metallization and Interconnect Systems for ULSI Applications , pp. 79
- Gignac, L.M.¹ Rodbell, K.P.² Clevenger, L.A.³ Iggulden, R.C.⁴ Schnabel, R.F.⁵ Weber, S.J.⁶ Lavoie, C.⁷ Cabral C., Jr.⁸ DeHaven, P.W.⁹ Wang, Y.-Y.¹⁰ Boettcher, S.H.¹¹

14
- 0005239062
- Montreal, Canada, August
- (1999) Proceedings of the International Conference on Textures of Materials , pp. 1287
- Rodbell, K.P.¹ Gignac, L.M.² Hurd, J.L.³ Wang, Y.-Y.⁴ Filippi, R.⁵ Clevenger, L.A.⁶ Iggulden, R.C.⁷ Schnabel, R.F.⁸ Weber, S.⁹

15
- 0031703508
- Reno, Nevada, IEEE, New York
- (1998) 36th Annual Proceedings of Reliability Physic , pp. 329
- Hosaka, M.¹ Kouno, T.² Hayakawa, Y.³

16
- 0032527245
- (1998) J. Appl. Phys. , vol.84 , pp. 742
- Kouno, T.¹ Hosaka, M.² Niwa, H.³ Yamada, M.⁴

17
- 0029308107
- (1995) Thin Solid Films , vol.260 , pp. 124
- Hu, C.-K.¹

18
- 0005363145
- June
- (1999) Proceedings of the International Interconnect Technology Conference , pp. 203
- Ravikumar, R.¹ Cichy, H.² Filippi, R.G.³ Kiewra, E.W.⁴ Rath, D.L.⁵ Stojakovic, G.⁶

19
- 0016940795
- (1976) J.Appl. Phys. , vol.47 , pp. 1203
- Blech, I.A.¹

20
- 0000519002
- (1998) Appl. Phys. Lett. , vol.73 , pp. 2748
- Proost, J.¹ Maex, K.² Delaey, L.³

21
- 0000697090
- (1986) J. Appl. Phys. , vol.59 , pp. 3890
- Shatzkes, M.¹ Lloyd, J.R.²

22
- 0003354983
- (1991) J. Appl. Phys. , vol.70 , pp. 172
- Kirchheim, R.¹ Kaeber, U.²

23
- 0002440396
- (1996) J. Appl. Phys. , vol.80 , pp. 4952
- Domenicucci, A.G.¹ Filippi, R.G.² Choi, K.W.³ Hu, C.-K.⁴ Rodbell, K.P.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.