A novel power module design and technology for improved power cycling capability

Microelectronics Reliability

Volumn 41, Issue 9-10, 2001, Pages 1713-1718

  Scheuermann, U ^a   Herr, E ^b  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

^b ABB SWITZERLAND LTD   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SINKS; INTERFACES (MATERIALS); POWER ELECTRONICS; STATISTICAL METHODS; SUBSTRATES;

POWER CYCLING TESTS; POWER MODULES;

ELECTRONICS PACKAGING;

EID: 0035457087     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00205-0     Document Type: Article

References (5)

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2. E.Herr and S.Dewar, LoPak IGBT Modules - Inverter Reliability Benefits, Proc. PCIM, Boston (2000).
3. U.Hecht, U.Scheuermann, Static and Transient Thermal Resistance of Advanced Power Modules, Proc. PCIM 2001, PC 10.3, 299-305.
4. VDI/VDE-IT Reihe Innovationen in der Mikrosystemtechnik, Band 69, Abschlußbericht Integrierte Leistungselekronische Systeme (2000) 108-109.
5. M.Held, P.Jacob, G.Nicoletti, P.Scacco, M.H.Poech, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. Power Electronics and Drive Systems 1997, 425-430.