Modularized low temperature LNO/PZT/LNO ferroelectric capacitor-over-interconnect (COI) FeRAM for advanced SOC(ASOC) application

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2002, Pages 479-482

  Lung, S L ^a   Lin, Dennis ^a   Chen, S S ^a   Weng, Gary ^a   Liu, C L ^a   Lai, S C ^a   Tsai, C W ^a   Wu, T B ^a   Liu, Rich ^a  

^a MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CRYSTALLIZATION; ELECTRODES; EPITAXIAL GROWTH; FERROELECTRIC DEVICES; LANTHANUM COMPOUNDS; LARGE SCALE SYSTEMS; LOW TEMPERATURE EFFECTS; PEROVSKITE; PIEZOELECTRIC TRANSDUCERS; SPUTTER DEPOSITION; SURFACE MOUNT TECHNOLOGY;

CAPACITOR-OVER-INTERCONNECTS (COI);

RANDOM ACCESS STORAGE;

EID: 0036049424     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. 9 thin films with a reductive process
2. 64 Kbit CMVP feram macro with reliable retention/imprint characteristics
3. Low thermal-budget fabrication of sputtered-PZT capacitor on multilevel interconnects for embedded FeRAM
4. Low temperature epitaxial growth of PZT on conductive perovskite LaNiO3 electrode for embedded capacitor-over-interconnect(COI) FeRAM application
5. Effect of composition and temperature on electric fatigue of La-doped lead zirconate titanate ceramics