70 nm contact hole pattern with shrink technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4690 II, Issue , 2002, Pages 671-678

  Shiu, Lin Hung ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Contact hole pattern; Hole shrinkage; KrF lithography; Post development; Thermal flow resist

Indexed keywords

ETCHING; MASKS; SCANNING ELECTRON MICROSCOPY; SHRINKAGE;

HOLE SHRINKAGE; THERMAL FLOW RESISTS;

PHOTORESISTS;

EID: 0036031387     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.474267     Document Type: Conference Paper

References (5)

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2. K. Aramaki, T. Hamada, D.K. Lee, H. Okazaki, and N. Tsugama, "Techniques to Print sub-0.2 μm Contact Holes", Proc. SPIE, 3999, pp. 738-749, 2000.
3. J.-H. Chung, S.-J. Choi, Y. Kang, S.-G. Woo, and J.-T. Moon, "A Novel Resist Material for sub-100nm Contact Hole Pattern", Proc. SPIE, 3999, pp. 305-312, 2000.
4. J.-W. Sung, D.-W. Lee, H. Kitaguchi, H. Fukiya, A. Awaji, C.-G. Park and L. Linehan, "Characterization of Thermal Flow Contact-Hole Resist; Impact of Raw Materials on Thermal Behavior of Resist", pp. 1-6, Semicon Taiwan 2001.
5. J.-S. Kim, C.-W. Koh, G. Lee, J.-C. Jung, and K.-S. Shin, "Novel Routes toward Sub-70nm Contact Windows by Using New KrF Photoresist", Proc. SPIE, 4345, pp. 232-240, 2001.