Residual stress and thermal expansion behavior of TaOxNy films by the micro-cantilever method

Thin Solid Films

Volumn 401, Issue 1-2, 2001, Pages 291-297

  Jong, Chao An ^a   Chin, Tsung Shune ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Elastic modulus; MEMs; Microcantilever method; Nanoindentation; Residual stress; TaOxNy films; Thermal expansion coefficient

Indexed keywords

CANTILEVER BEAMS; ELASTIC MODULI; MICROELECTROMECHANICAL DEVICES; RESIDUAL STRESSES; TANTALUM ALLOYS; THERMAL EXPANSION;

NANOIDENTATION;

METALLIC FILMS;

EID: 0035904915     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(01)01626-1     Document Type: Article

References (17)