Creep behavior of cold-rolled nanocrystalline pure copper

Scripta Materialia

Volumn 45, Issue 12, 2001, Pages 1407-1413

  Cai, B ^a   Kong, Q P ^a   Cui, P ^a   Lu, L ^b   Lu, K ^b  

^a INSTITUTE OF SOLID STATE PHYSICS   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Cold rolling; Creep; Grain boundary; Nanocrystalline copper

Indexed keywords

ACTIVATION ENERGY; COLD ROLLING; COPPER; CREEP; GRAIN BOUNDARIES; STRESSES;

THRESHOLD STRESSES;

NANOSTRUCTURED MATERIALS;

EID: 0035904892     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)01177-0     Document Type: Article

References (20)