Simulation analysis of dispatching rules for an automated interbay material handling system in wafer fab

International Journal of Production Research

Volumn 39, Issue 6, 2001, Pages 1221-1238

  Lin, J T ^a,b   Wang, Fu Kwun ^a,b   Yen, Ping Yung ^a,b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; COMPUTER SIMULATION; HEURISTIC METHODS; MATERIALS HANDLING; MATHEMATICAL MODELS; PLANT LAYOUT; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

AUTOMATED INTERBAY MATERIAL HANDLING SYSTEM; DIRECT EVENT SIMULATION; DISPATCHING RULES; RESPONSE SURFACE METHODOLOGY; SOFTWARE PACKAGE SIMPLE++;

OPERATIONS RESEARCH;

EID: 0035872172     PISSN: 00207543     EISSN: None     Source Type: Journal    
DOI: 10.1080/00207540010005718     Document Type: Article

References (13)

1. Cardarelli, G., and Pelagagge, P. M., 1995, Simulation tool for design and management optimization of automated interbay material handling and storage systems for large wafer fab. IEEE Transactions on Semiconductor Manufacturing, 8, 44-49.
2. Cardarelli, G., Pelagagge, P. M., and Granito, A., 1993, Track-robot for wafer fabrication intrabay handling. Assembly Automation, 13, 25-29.
3. Cardarelli, G., Pelagagge, P. M., and Granito, A., 1996, Performance analysis of automated interbay material-handling and storage systems for large wafer fab. Robotics and Computer-Integrated Manufacturing, 12, 227-234.
4. Colvin, T. D., Lawrence, F. P., and Mackulak, G. T., 1998, Soft simulation crucial for new automated fab decisions. Solid State Technology, 41, 161-168.
5. Davis, F., and Weiss, M., 1995, Addressing automated materials handling in an existing waferfab. Semiconductor International, 18, June, 3pp.
6. Egbelu, P. J., and Tanchoco, M. A., 1984, Characterization of automatic-guided vehicle dispatching rules. International Journal of Production Research, 22, 359-374.
7. Jefferson, T., 1996, Simulation in the design of ground-based intrabay automation systems. Proceedings of the 1996 Winter Simulation Conference, IEEE, pp. 1008-1013.
8. Mackulak, G. T., Lawrence, F. P., and Rayter, J., 1998, Simulation analysis of 300 mm intrabay automation vehicle capacity alternatives. IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 445-450.
9. Myers, R. H., and Montgomer, D C., 1995, Response Surface Methodology (New York: Wiley).
10. Pierce, N. G., and Stafford, R., 1994, Modeling and simulation of material handling for semiconductor wafer fabrication. Proceedings of the 1994 Winter Simulation Conference, IEEE, pp. 900-906.
11. Pillai, D., 1990, Material handling automation for wafer fabrication facilities. Proceedings, IEEE/CHMT Ninth International Electronic Manufacturing Technology Symposium Ninth, pp. 277-286.
12. SIMPLE + +, 1999, Reference Manual Version 6.0 (Stuttgart: AESOP).
13. Stat-Ease, 1997, Design-Expert Version 5.0.8 (Minneapolis: Stat-Ease).