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Volumn 61, Issue 2-4, 2001, Pages 379-383
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Is there a way to improve the uniformity of TiN deposition conditions in large pulsed d.c. plasma CVD reactors?
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Author keywords
Plasma CVD; Pulsed discharge; Titanium nitride; Uniform deposition
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Indexed keywords
ELECTRIC CONDUCTIVITY OF GASES;
ELECTRIC CURRENTS;
ELECTRIC DISCHARGES;
ELECTRIC POTENTIAL;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
TITANIUM NITRIDE;
TITANIUM NITRIDE COATINGS;
PROTECTIVE COATINGS;
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EID: 0035858707
PISSN: 0042207X
EISSN: None
Source Type: Journal
DOI: 10.1016/S0042-207X(01)00148-8 Document Type: Conference Paper |
Times cited : (6)
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References (9)
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