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Volumn 61, Issue 2-4, 2001, Pages 379-383

Is there a way to improve the uniformity of TiN deposition conditions in large pulsed d.c. plasma CVD reactors?

Author keywords

Plasma CVD; Pulsed discharge; Titanium nitride; Uniform deposition

Indexed keywords

ELECTRIC CONDUCTIVITY OF GASES; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; ELECTRIC POTENTIAL; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TITANIUM NITRIDE;

EID: 0035858707     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0042-207X(01)00148-8     Document Type: Conference Paper
Times cited : (6)

References (9)
  • 1
    • 17744386406 scopus 로고    scopus 로고
    • Rübig GmbH, Wels, Austria, www.rubig.com.
    • Rübig GmbH, Wels, Austria, www.rubig.com.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.