-
1
-
-
0001121144
-
Optimal yield improvement in multi-stage manufacturing systems
-
Barad, M., and Bennett, G., "Optimal Yield Improvement in Multi-Stage Manufacturing Systems," European Journal of Operational Research, 1996, Vol. 93, pp. 549-565.
-
(1996)
European Journal of Operational Research
, vol.93
, pp. 549-565
-
-
Barad, M.1
Bennett, G.2
-
3
-
-
0003222943
-
Process-based cost modeling
-
Bloch, C., and Ranganathan, R., "Process-Based Cost Modeling," IEEE Trans. on Computers, Hybrids, and Manufacturing Technology, 1992, Vol. 15, pp. 288-294.
-
(1992)
IEEE Trans. on Computers, Hybrids, and Manufacturing Technology
, vol.15
, pp. 288-294
-
-
Bloch, C.1
Ranganathan, R.2
-
4
-
-
0026821291
-
Using yield models to accelerate learning curve progress
-
Dance, D. and Jarvis, R., "Using Yield Models to Accelerate Learning Curve Progress," IEEE Trans. Semiconductor Manufacturing, 1992, Vol. 5, pp. 41-45.
-
(1992)
IEEE Trans. Semiconductor Manufacturing
, vol.5
, pp. 41-45
-
-
Dance, D.1
Jarvis, R.2
-
5
-
-
0028115165
-
Component level yield/cost model for predicting VLSI manufacturability on designs using mixed technologies, circuitry, and redundancy
-
Domer, S. M., Foertsch, S. A., and Raskin, G. D., "Component Level Yield/Cost Model for Predicting VLSI Manufacturability on Designs Using Mixed Technologies, Circuitry, and Redundancy," IEEE Custom Integrated Circuits Conference, 1994, pp. 313-318.
-
IEEE Custom Integrated Circuits Conference, 1994
, pp. 313-318
-
-
Domer, S.M.1
Foertsch, S.A.2
Raskin, G.D.3
-
6
-
-
0034262555
-
Manufacturing to order with random yield and costly inspection
-
Grosfeld-Nir, A., Gerchak, Y., and He, Q., "Manufacturing to Order with Random Yield and Costly Inspection," Operations Research, 2000, Vol. 48, pp. 761-767.
-
(2000)
Operations Research
, vol.48
, pp. 761-767
-
-
Grosfeld-Nir, A.1
Gerchak, Y.2
He, Q.3
-
7
-
-
0242710842
-
Automated high level process planning and manufacturability analysis for agile manufacturing
-
Department of Mechanical Engineering, University of Maryland, MS Thesis
-
Lam, G. V., "Automated high Level Process Planning and Manufacturability Analysis for Agile Manufacturing," Department of Mechanical Engineering, University of Maryland, MS Thesis, 1995.
-
(1995)
-
-
Lam, G.V.1
-
8
-
-
0033751244
-
Cost analysis: Solder bumped flip chip versus wire bonding
-
Lau, J. H., "Cost Analysis: Solder Bumped Flip Chip Versus Wire Bonding," IEEE Trans. on Electronics Packaging Manufacturing, 2000, Vol. 23, pp. 4-11.
-
(2000)
IEEE Trans. on Electronics Packaging Manufacturing
, vol.23
, pp. 4-11
-
-
Lau, J.H.1
-
9
-
-
0030084489
-
Yield and cost model for integrated optical chips
-
Marz, R., Mahlein, H. F., and Acklin, B., "Yield and Cost Model for Integrated Optical Chips," IEEE Journal of Lightwave Technology, 1996, Vol. 14, pp. 158-163.
-
(1996)
IEEE Journal of Lightwave Technology
, vol.14
, pp. 158-163
-
-
Marz, R.1
Mahlein, H.F.2
Acklin, B.3
-
10
-
-
0024084939
-
Forecasting MMIC yields and costs
-
Sept.
-
Matsuno, C. T., Sharma, A. K., Liu, L. C. T., and Esfandiari, R., "Forecasting MMIC Yields and Costs," Microwave Journal, Sept. 1988, Vol. 31, pp. 105-128.
-
(1988)
Microwave Journal
, vol.31
, pp. 105-128
-
-
Matsuno, C.T.1
Sharma, A.K.2
Liu, L.C.T.3
Esfandiari, R.4
-
11
-
-
0000558344
-
A generative approach for concurrent manufacturability evaluation and subcontractor selection
-
Minnis, I., Herrmann, J. W., Lam, G., and Lin, E., "A Generative Approach for Concurrent Manufacturability Evaluation and Subcontractor Selection," Journal of Manufacturing Systems, 1999, Vol. 18, pp. 383-395.
-
(1999)
Journal of Manufacturing Systems
, vol.18
, pp. 383-395
-
-
Minnis, I.1
Herrmann, J.W.2
Lam, G.3
Lin, E.4
-
12
-
-
0003348939
-
A design tool for a manufacturing system for integrated passives
-
Power, C., Realff, M., and Battacharya, S., "A Design Tool for a Manufacturing System for Integrated Passives," IMAPS 4th Advanced Technology Workshop on Integrated Passives Technology, 1999.
-
IMAPS 4th Advanced Technology Workshop on Integrated Passives Technology, 1999
-
-
Power, C.1
Realff, M.2
Battacharya, S.3
-
13
-
-
0000231359
-
Super-compact enhancement will predict yield
-
June
-
Rhode, U. L., "Super-Compact Enhancement Will Predict Yield," Microwaves & RF, June 1987, pp. 163-172.
-
(1987)
Microwaves & RF
, pp. 163-172
-
-
Rhode, U.L.1
-
14
-
-
0023090181
-
Improve yield forecasts - Reduce production costs
-
June
-
Santana, M., and Blau, R., "Improve Yield Forecasts - Reduce Production Costs," Microwaves & RF, June 1987, Vol. 26, pp. 83-90.
-
(1987)
Microwaves & RF
, vol.26
, pp. 83-90
-
-
Santana, M.1
Blau, R.2
-
15
-
-
0242710843
-
-
SavanSys, commercial cost analysis software tool for electronic systems from Foresight Systems, Inc.
-
SavanSys, commercial cost analysis software tool for electronic systems from Foresight Systems, Inc. (http://www.foresight-systems.com), 2001.
-
(2001)
-
-
-
16
-
-
0024479792
-
Manufacturing cost analysis of optoelectronic integrated circuits
-
Schuelke, R. J., and Pande, K. P., "Manufacturing Cost Analysis of Optoelectronic Integrated Circuits," IEEE Transactions on Semiconductor Manufacturing, 1989, Vol. 2, pp. 29-30.
-
(1989)
IEEE Transactions on Semiconductor Manufacturing
, vol.2
, pp. 29-30
-
-
Schuelke, R.J.1
Pande, K.P.2
-
17
-
-
0022899851
-
Printed Circuit Pack (PCP) yield prediction
-
Sultan, T. I., "Printed Circuit Pack (PCP) Yield Prediction," Computers in Industry, 1986, Vol. 7, pp. 537-541.
-
(1986)
Computers in Industry
, vol.7
, pp. 537-541
-
-
Sultan, T.I.1
|