Plasma deposited cf polymer films as ultra low k intermetal dielectric, film properties and application

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 250-256

  Uhlig, Matthias ^a   Bertz, A ^a   Werner, T ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS MATERIALS; CHEMICAL MECHANICAL POLISHING; CROSSTALK; CURRENT DENSITY; DIELECTRIC MATERIALS; HEAT TREATMENT; OPTICAL PROPERTIES; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; VACUUM APPLICATIONS;

INTERMETAL DIELECTRIC;

ULSI CIRCUITS;

EID: 0035790768     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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